IEC 61191-1:2018 印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

标准编号：IEC 61191-1:2018

中文名称：印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

英文名称：Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

发布日期：2018-09-14

标准范围

新的！IEC 61191-1:20 18作为IEC 61191-1:20 18 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 61191-1:20 18规定了使用表面贴装和相关组装技术生产高质量焊接互连和组件的材料、方法和验证标准的要求。IEC 61191的这一部分还包括良好制造工艺的建议。与上一版相比，此版本包括以下重大技术变更:-已更新要求以符合IPC中的可接受标准？A-610F;-术语“装配图”已全部改为“装配文件”；-更正了对IEC标准的引用；-第9条完全重写；-删除附件B，因为已经有电路板组装的程序。

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC？A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

标准预览图