IEC 62047-37:2020 半导体器件微机电器件第37部分:传感器用MEMS压电薄膜的环境试验方法

标准编号：IEC 62047-37:2020

中文名称：半导体器件微机电器件第37部分:传感器用MEMS压电薄膜的环境试验方法

英文名称：Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

发布日期：2020-04-28

标准范围

IEC 62047-37:2020规定了评估MEMS压电薄膜材料在温度和湿度的环境应力和机械应力和应变下耐久性的测试方法，以及适当质量评估的测试条件。具体而言，本文件规定了在温度和湿度条件以及施加电压下测量DUT耐久性的测试方法和测试条件。它还适用于主要在硅衬底上形成的压电薄膜(即用作声学传感器或悬臂型传感器的压电薄膜)中的直接压电性质的评估。本文档不涵盖可靠性评估，例如基于威布尔分布预测压电薄膜寿命的方法。

IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

标准预览图