IEC 62148-21:2019 光纤有源元件和器件封装和接口标准第21部分:硅细间距球栅阵列（S-FBGA）和硅细间距陆栅阵列（S-FLGA）PIC封装电接口设计指南

标准编号：IEC 62148-21:2019

中文名称：光纤有源元件和器件封装和接口标准第21部分:硅细间距球栅阵列（S-FBGA）和硅细间距陆栅阵列（S-FLGA）PIC封装电接口设计指南

英文名称：Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

发布日期：2019-03-11

标准范围

IEC 62148-21:20 19涵盖了使用硅细间距球栅阵列（S-FBGA）和硅细间距陆栅阵列（S-FLGA）的光子集成电路（PIC）封装的电气接口设计指南。在本文档中，S-FBGA封装的电气接口信息丰富。本文件的目的是充分规定由光学发射器和接收器组成的PIC封装的电气接口，以实现PIC封装的机械和电气互换性。关键词:光子集成电路（PIC）封装的电气接口

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

标准预览图