IEC 63011-2:2018 集成电路.三维集成电路.第2部分:具有细间距互连的叠层模具的对准

标准编号：IEC 63011-2:2018

中文名称：集成电路.三维集成电路.第2部分:具有细间距互连的叠层模具的对准

英文名称：Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

发布日期：2018-11-28

标准范围

IEC？63011-2:2018？提供了芯片键合过程中多个堆叠集成电路之间的初始对准和对准维护规范。这些规范定义了校准键和键的操作程序。这些规范仅适用于在芯片堆叠中使用芯片对芯片对准的电耦合方法的情况。

IEC？63011-2:2018？provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

标准预览图