IEC 63055:2016 LSI-Package-Board互操作设计格式

标准编号：IEC 63055:2016

中文名称：LSI-Package-Board互操作设计格式

英文名称：Format for LSI-Package-Board Interoperable design

发布日期：2016-11-08

标准范围

IEC 63055:2016(E)定义了一种通用的可互操作格式，用于设计a)大规模集成(LSI)，b)用于这种LSI的封装，以及c)在其上互连封装的LSI的印刷电路板。这些设计统称为“LSI封装板”(LPB)设计。该格式提供了一种通用方法来指定有关LPB设计中使用的项目管理、网表、组件、设计规则和几何图形的信息/数据。本标准作为双标识IEC-IEEE标准发布。

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

标准预览图