ISO 9453:2006 软钎料合金.化学成分和形式
标准编号：ISO 9453:2006
中文名称：软钎料合金.化学成分和形式
英文名称：Soft solder alloys — Chemical compositions and forms
发布日期：2006-10
标准范围
ISO 9453:2006规定了以下软焊料合金系列的化学成分要求:锡铅，含和不含锑、铋、镉、铜和银；锡锑；锡铋；锡铜，含银和不含银；锡-铟，有和没有银和铋；锡银，含或不含铜和铋；锡锌，含和不含铋。ISO 9453:2006还包括通常可获得的形式的指示。
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
标准预览图
