IEC 60749-20-1:2019 半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感

标准编号：IEC 60749-20-1:2019

中文名称：半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感

英文名称：Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

发布日期：2019-06-26

标准范围

IEC 60749-20-1:20 19作为IEC 60749-20-1:20 19 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-20-1:20 19适用于PCB组装过程中经历本体焊料回流工艺的所有器件，包括塑料封装封装、工艺敏感器件和其他由透湿材料（环氧树脂、硅树脂等）制成的湿敏器件。）暴露在环境空气中。本文件的目的是为SMD制造商和用户提供处理、包装、运输和使用湿气/回流敏感SMD的标准化方法，这些SMD已被分类到IEC 60749-20中定义的级别。提供这些方法是为了避免由于吸湿和暴露于可导致成品率和可靠性降低的焊料回流温度而造成的损坏。通过使用这些程序，可以通过干包装过程实现安全和无损坏的回流，从密封日期起在密封的干袋中提供最小的保质期能力。与上一版相比，此版本包括以下重大技术变更:-更新子条款，使试验方法更好地与IPC/JEDEC J-STD-033C保持一致，包括关于水性清洗和干包装注意事项的新章节；-增加了关于HIC（湿度指示卡）比色测试和烘烤表推导的两个附件。

IEC 60749-20-1:2019 is available as IEC 60749-20-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition:
- updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions;
- addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

标准预览图