IEC 61760-2:2021 表面安装技术 - 第2部分:表面安装器件（SMD）的运输和存储条件 - 应用指南

标准编号：IEC 61760-2:2021

中文名称：表面安装技术 - 第2部分:表面安装器件（SMD）的运输和存储条件 - 应用指南

英文名称：Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

发布日期：2021-07-16

标准范围

IEC 61760-2:20 21作为IEC 61760-2:20 21 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 61760-2:20 21规定了表面贴装器件(SMD)的运输和储存条件，这些条件是为了实现有源和无源表面贴装器件的无故障加工。（不考虑印制板的条件。）本文件的目的是确保SMD用户在不影响质量和可靠性的情况下接收和存储可以进一步加工（如定位、焊接）的产品。SMD的不当运输和储存会导致劣化，并导致组装问题，例如可焊性差、分层和“爆裂”。从本文件第3版到上一版2的参考文献的交叉引用列于本文件的附录X。

IEC 61760-2:2021 is available as IEC 61760-2:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

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