IEC 60191-1:2018 半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

标准编号：IEC 60191-1:2018

中文名称：半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

英文名称：Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

发布日期：2018-01-23

标准范围

IEC？60191-1:20 18（E）给出了分立器件轮廓图编制指南，包括引线数小于8的分立表面贴装半导体器件。与上一版相比，此版本包括以下重大技术变更:a)范围已经扩展到包括引线计数小于8的表面安装半导体器件；b)增加了术语“立足点”的定义；c)用于定位基准的方法已经扩展到适用于SMD封装；d)明确了用于自动处理的终端位置一的视觉识别；e)明确了终端的绘制规则；f)表A.1已经用专门用于SMD封装的符号完成；g)删除了附件B“标准化理念”；h)增加了带有SMD封装特殊规则的规范性附件；i)半导体器件附图的示例已经与包括SMD封装的现有技术封装对齐。

IEC？60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

标准预览图