IEC 60352-5:2020 无焊连接.第5部分:压入连接.一般要求、试验方法和实用指南

标准编号：IEC 60352-5:2020

中文名称：无焊连接.第5部分:压入连接.一般要求、试验方法和实用指南

英文名称：Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

发布日期：2020-07-22

标准范围

IEC 60352-5:20 20适用于电气和电子设备及部件中使用的无焊压入式连接。压入连接由具有合适的压入区的终端组成，该压入区插入到板的孔中。除了测试程序之外，还包括材料信息和来自工业经验的数据，以在指定的环境条件下提供电气稳定的连接。本文件的目的是确定压入式连接在压入式终端制造商规定的机械、电气和大气条件下的适用性，并提供一种在用于制造连接的工具具有不同设计或制造时比较测试结果的方法。这第五版取消并取代了2012年出版的第四版。本版构成技术修订版。与上一版相比，此版本包含以下重大变更:a)修改范围，删除第一段中的“……电信设备和采用类似技术的电子设备”，代之以“……电气和电子设备及部件”；b)增加“板”、“孔”和“金属板”的术语和定义，以认识到压入式终端正用于许多非印刷板材料中；c)编辑变更，以澄清资格和申请的两个测试时间表之间的差异；d)修改电镀通孔的铜厚度上限以反映实际市场趋势和制造实践；e)取消弯曲测试，因为该测试对于压力机的应用非常具体-在技术上不再常见；f)添加图表来记录压入和推出力，因为这是常见的测试实践，并且提供了对接触区机械性能的进一步了解；g)减少所需测试样本的数量，因为在先前的测试方案中，许多测试样本被丢弃；h)4.5中关于破裂和弯曲终端的新措辞；i)添加了图7b，以示出当压入式终端不突出穿过电路板的底侧时V和A连接位置。

IEC 60352-5:2020 is applicable to solderless press-in connections for use in electrical and electronic equipment and components.
The press-in connection consists of a termination having a suitable press-in zone which is inserted into a hole of a board.
Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under specified environmental conditions.
The object of this document is to determine the suitability of press-in connections under mechanical, electrical and atmospheric conditions as specified by the manufacturer of the press-in termination and to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture.
This fifth edition cancels and replaces the fourth edition published in 2012. This edition constitutes a technical revision.
This edition includes the following significant changes with respect to the previous edition:
a) revising the scope by removing the wording "… telecommunication equipment and in electronic devices employing similar techniques" and replacing it by "… electrical and electronic equipment and components" in the first paragraph;
b) adding terms and definitions for 'board', 'hole' and 'metal board' to recognize that press-in terminations are being used in many non-printed board materials;
c) editorial changes to clarify the difference between the two test schedules for qualification and application;
d) modification of upper limit of copper thickness of the plated-through-hole to reflect actual market trends and manufacturing practices;
e) removal of bending test, as this test is very specific for applications of press-in technology no longer common;
f) adding graphs to document the press-in and push-out force, since this is common testing practice and provides further insight into mechanical performance of the contact zone;
g) reducing the number of test specimens required, since in previous testing scheme a lot of test samples were discarded;
h) new wording in 4.5 for cracked and bent terminations;
i) added Figure 7b to show V and A connection locations when the press-in termination does not protrude through the bottom side of the board.

标准预览图