IEC 63251:2023 热应力作用下柔性光电电路板机械性能试验方法

标准编号：IEC 63251:2023

中文名称：热应力作用下柔性光电电路板机械性能试验方法

英文名称：Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

发布日期：2023-11-01

标准范围

IEC 63251:2023定义了柔性光电电路板可靠性评估的耐热性试验方法。本文件的目的是适应汽车等高温环境中柔性光电电路所需的均匀热特性。特别是，本文件规定了一种测试方法，用于检查柔性光电电路板在热应力下是否发生颜色交换、变形和分层。

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

标准预览图