IEC 60749-5:2023 半导体器件.机械和气候试验方法.第5部分:稳态温湿度偏差寿命试验

标准编号：IEC 60749-5:2023

中文名称：半导体器件.机械和气候试验方法.第5部分:稳态温湿度偏差寿命试验

英文名称：Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

发布日期：2023-12-19

标准范围

IEC 60749-5:20 23作为IEC 60749-5:20 23 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-5:20 23提供了稳态温度和湿度偏置寿命测试，以评估非密封封装半导体器件在潮湿环境中的可靠性。该试验方法被认为是破坏性的。与上一版相比，此版本包括以下重大技术变更:a)测试设备的规格变更为要求需要使被测半导体器件之间的相对湿度梯度最小化和空气流量最大化；b)测试设备夹具的规格变更为要求避免被测设备和将设备连接到测试设备的电气夹具上的冷凝；c)用“管芯”替换对“虚拟结”的引用。

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.

标准预览图