IEC 62878-1:2019 器件嵌入组装技术第1部分:器件嵌入基板总规范

标准编号：IEC 62878-1:2019

中文名称：器件嵌入组装技术第1部分:器件嵌入基板总规范

英文名称：Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

发布日期：2019-10-14

标准范围

IEC 62878-1:20 19(E)规定了器件嵌入式基板的通用要求和测试方法。IEC 61189-3中规定了印制板基板材料和基板本身的基本测试方法。IEC 62878的这一部分适用于通过使用有机基材制造的器件嵌入式衬底，其包括例如有源或无源器件、在电子印刷电路板的制造过程中形成的分立部件和片状部件。IEC 62878系列既不适用于再分配层（RDL），也不适用于IEC 62421中定义的电子模块。

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

标准预览图