IEC 61189-2-808:2024 电气材料、印制板和其他互连结构和组件的试验方法.第2-808部分:用热瞬态法测定组件的热阻

标准编号：IEC 61189-2-808:2024

中文名称：电气材料、印制板和其他互连结构和组件的试验方法.第2-808部分:用热瞬态法测定组件的热阻

英文名称：Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

发布日期：2024-04-25

标准范围

IEC 61189-2-808:2024描述了表征由热源(例如功率器件)、附接材料(例如焊料)和具有电极的电介质层组成的组件的热阻的热瞬态方法。该方法适用于确定材料和组装方法的热阻以及优化散热器的热通量。注意:该方法不用于测量和指定电介质材料的热阻值。为此，存在其他标准。附件A给出了实例。

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

标准预览图