IEC 60286-3:2019 自动处理组件的包装 - 第3部分:连续胶带上表面贴装组件的包装

标准编号：IEC 60286-3:2019

中文名称：自动处理组件的包装 - 第3部分:连续胶带上表面贴装组件的包装

英文名称：Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

发布日期：2019-01-16

标准范围

IEC 60286-3:20 19作为IEC 60286-3:20 19 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60286-3:20 19适用于不带引线或带引线残端的电子元件的胶带封装，旨在连接到电子电路。它仅包括用于上述目的的部件的胶带所必需的那些尺寸。本文件还包括与包括裸芯片和凸块芯片（倒装芯片）在内的单片芯片产品的封装相关的要求。与上一版相比，此版本包括以下重大技术变更:-将分类表添加到关于磁带、卷轴和公共符号的符号中；-添加极性和取向的示例图以及点密封的示例图；-修订外倾角要求；-增加了关于倾斜的设计值的定义。

IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.

标准预览图