IEC 60115-2-10:2023 电子设备用固定电阻器.第2-10部分:空白详细规范:一般电子设备用电路板通孔组件（THT）用带引线的低功率薄膜电阻器 G级

标准编号：IEC 60115-2-10:2023

中文名称：电子设备用固定电阻器.第2-10部分:空白详细规范:一般电子设备用电路板通孔组件（THT）用带引线的低功率薄膜电阻器 G级

英文名称：Fixed resistors for use in electronic equipment - Part 2-10: Blank detail specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

发布日期：2023-02-15

标准范围

IEC 60115-2-10:20 23是一项详细规范，规定了用于电子设备的带引线的低功率薄膜电阻器的特性和额定值，这些电阻器通常采用通孔技术(THT)组装在电路板上。本详细规范建立了测试计划和性能要求，允许根据IEC 60115-1:20 20附录Q规定的质量评估程序对本文涵盖的电阻器进行质量评估。本第一版取消并取代IEC 60115-2-1:19 82。本版构成技术修订版。与上一版相比，此版本包括以下重大技术变更:它采用基于通用规范IEC 60115中定义的应用要求的产品分类？1:2020;它允许规定关于终端导线的偏心度和延伸到导线上的涂层的附加尺寸要求；它提供了与温度系数和公差相关的电阻范围的列表表示；根据需要，它支持传统含铅焊接和最新无铅焊接的可焊性测试；介绍了试样对静电放电鲁棒性的测试；它介绍了样品耐溶剂性的测试；它介绍了试样可燃性的测试；它采用按稳定性类别分组的一致稳定性要求；支持提供详细的目视验收标准；它包括对初级包装和邻近包装进行目视检查的要求；它为资格批准和随后的质量符合性检查提供了相关的测试时间表；它采用符合零缺陷方法要求的质量评估程序，避免使用历史AQL水平和测试组中不合格样本的许可；它规定纳入特定的目视验收标准，除了部分规范IEC 60115-2:20 23附录B中给出的标准之外，还应应用这些标准；它规定了在起草的详细规范范围内可选覆盖0 Ω电阻（跳线）；此外，它采用了新的文件结构，附件十提供了过渡指导。

IEC 60115-2-10:2023 is a detail specification which specifies the characteristics and ratings of low-power film resistors with leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q.
This first edition cancels and replaces IEC 60115-2-1:1982. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
it employs the product classification based on application requirements as defined in the generic specification IEC 60115？1:2020;
it permits the specification of additional dimensional requirements concerning the eccentricity of termination wires and the coating extending onto wires;
it provides for a tabulated presentation of resistance ranges in relationship to the temperature coefficient and the tolerance;
it supports solderability testing for both traditional lead-bearing soldering and up-to-date lead-free soldering, as required;
it introduces a test for the specimens’ robustness to electrostatic discharge;
it introduces a test for the specimens’ resistance to solvents;
it introduces a test for the flammability of the specimens;
it employs consistent stability requirements grouped in stability classes;
it supports the provision of detailed visual acceptance criteria;
it includes the requirement for a visual examination of the primary and proximity packaging;
it provides the correlated test schedules for a qualification approval and for subsequent quality conformance inspections side by side;
it employs quality assessment procedures which meet the requirements of a zero-defect approach, which evades the use of historic AQL levels and the permission of non-conforming specimens in test groups;
it provides for the inclusion of specific visual acceptance criteria, to be applied in addition to those given in Annex B of the sectional specification IEC 60115-2:2023;
it provides for the optional coverage of 0 Ω resistors (jumpers) within the scope of the drafted detail specification;
furthermore, it employs a new document structure, for which a transition guidance is provided in Annex X.

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