IEC TS 61967-3:2014 集成电路.电磁发射的测量.第3部分:辐射发射的测量.表面扫描法

标准编号：IEC TS 61967-3:2014

中文名称：集成电路.电磁发射的测量.第3部分:辐射发射的测量.表面扫描法

英文名称：Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method

发布日期：2014-08-25

标准范围

IEC TS 61967-3:20 14提供了测试程序，其定义了集成电路(IC)表面处或附近的近电场、磁场或电磁场分量的评估方法。此诊断程序旨在用于IC架构分析，如楼层规划和配电优化。本测试程序适用于对安装在扫描探头可触及的任何电路板上的IC进行测量。在某些情况下，不仅扫描IC而且扫描其环境是有用的。为了比较不同IC之间的表面扫描发射，应使用IEC 61967-1中定义的标准化测试板。该测量方法提供了IC上的电或磁近场发射的映射。测量的分辨率由测量探头的能力和探头的精度决定-定位系统。该方法旨在用于高达6 GHz的频率。利用现有探头技术扩展频率上限是可能的，但超出了本说明书的范围。可以在频域或时域中执行测量。与上一版相比，此版本包括以下重大技术变更:a)删除:第9.4条数据分析和附件D分析来自近场表面扫描的数据；b)增加:导言、第9.4条测量数据、第9.5条后处理、第9.6条数据交换和附件D坐标系；c)扩展:第8.4条测试技术和附件A近场探头校准。

IEC TS 61967-3:2014 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain. This edition includes the following significant technical changes with respect to the previous edition:
a) Removal of: Clause 9.4 Data analysis and Annex D Analysing the data from near-field surface scanning;
b) Addition of: Introduction, Clause 9.4 Measurement data, Clause 9.5 Post-processing, Clause 9.6 Data exchange and Annex D Coordinate systems;
c) Expansion of: Clause 8.4 Test technique and Annex A Calibration of near-field probes.

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