IEC 62951-1:2017 半导体器件 - 柔性和可拉伸半导体器件 - 第1部分:柔性基板上导电薄膜的弯曲试验方法

标准编号：IEC 62951-1:2017

中文名称：半导体器件 - 柔性和可拉伸半导体器件 - 第1部分:柔性基板上导电薄膜的弯曲试验方法

英文名称：Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

发布日期：2017-04-10

标准范围

IEC 62951-1:2017（E）规定了一种弯曲试验方法，用于测量沉积或粘合在柔性非导电基板上的导电薄膜的机电性能或柔韧性。柔性衬底上的导电薄膜广泛应用于柔性电子器件和柔性半导体中。导电薄膜包括沉积或粘结在非导电柔性衬底上的任何薄膜，例如金属薄膜、透明导电电极和硅薄膜。柔性衬底上薄膜的电学和力学行为不同于独立薄膜和衬底，这是由于薄膜和衬底之间的界面相互作用和粘附。本标准的目的是建立简单且可重复的测试方法，用于评估柔性基板上导电薄膜的机电性能或柔韧性。弯曲试验方法包括外弯曲试验和内弯曲试验。

IEC 62951-1:2017(E) specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors. Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film. The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate. The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate. The bending test methods include outer bending test and inner bending test.

标准预览图