IEC 60191-6-13:2016 半导体器件的机械标准化 - 第6-13部分:微型球栅阵列（Fbga）和微距格栅阵列（Flga）的开顶型插座设计指南

标准编号：IEC 60191-6-13:2016

中文名称：半导体器件的机械标准化 - 第6-13部分:微型球栅阵列（Fbga）和微距格栅阵列（Flga）的开顶型插座设计指南

英文名称：Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

发布日期：2016-09-27

标准范围

IEC 60191-6-13:20 16规定了用于细间距球栅阵列(FBGA)和细间距地栅阵列(FLGA)的开顶型半导体插座的设计指南。特别是，IEC 60191的这一部分建立了应用于FBGA和FLGA的开顶型测试和老化插座的轮廓图和尺寸。与上一版相比，此版本包括以下重大技术变更:a)BGA封装标称长度和宽度分别新扩展至43 mm和43 mm。因此，在插座组编号1、2和3中增加了6个插座尺寸，在插座组编号4中增加了22个插座尺寸。

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

标准预览图