IEC 60749-30:2020 半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理

标准编号：IEC 60749-30:2020

中文名称：半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理

英文名称：Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

发布日期：2020-08-17

标准范围

IEC 60749-30:2020作为IEC 60749-30:2020 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-30:2020建立了用于确定可靠性测试前非密封表面贴装器件(SMD)预处理的标准程序。该测试方法定义了非密封固态SMD的预处理流程，代表了典型的工业多重焊料回流操作。在提交特定的内部可靠性测试（鉴定和/或可靠性监测）之前，这些SMD经过本文件中描述的适当预处理序列，以评估长期可靠性（受焊接应力影响）。与上一版相比，此版本包括以下重大技术变更:-加入新订的第3条；-焊料回流时6.7的膨胀；-列入解释性说明和澄清。

IEC 60749-30:2020 is available as IEC 60749-30:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.

标准预览图