IEC 62951-5:2019 半导体器件.柔性和可伸展半导体器件.第5部分:柔性材料热特性的试验方法

标准编号：IEC 62951-5:2019

中文名称：半导体器件.柔性和可伸展半导体器件.第5部分:柔性材料热特性的试验方法

英文名称：Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

发布日期：2019-02-27

标准范围

IEC 62951-5:2019规定了柔性材料热特性的试验方法。本文件包括可用于评估和确定实际使用的柔性材料热特性的术语、定义、符号和试验方法。该测量方法依赖于基于温度相关光学反射的非接触光学测温。本文件适用于经受弯曲和拉伸的基板和薄膜柔性半导体材料。

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

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