IEC 62878-2-5:2019 器件嵌入组装技术.第2-5部分:指南.器件嵌入衬底的3D数据格式的实现

标准编号：IEC 62878-2-5:2019

中文名称：器件嵌入组装技术.第2-5部分:指南.器件嵌入衬底的3D数据格式的实现

英文名称：Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

发布日期：2019-09-16

标准范围

IEC 62878-2-5:20 19规定了基于XML模式的要求，该XML模式表示器件嵌入式衬底的设计数据格式，该器件嵌入式衬底是包括嵌入式有源和无源器件的板，其电连接通过过孔、电镀、导电膏或导电材料的印刷进行。该数据格式将用于模拟（例如应力、热、EMC）、工具、制造、装配和检验要求。此外，该数据格式用于在印刷电路板设计者、印刷电路板仿真工程师、制造商和组装商之间传递信息。IEC 62878-2-5:20 19适用于使用有机材料的基材。它既不适用于再分配层（RDL），也不适用于IEC 62421中定义为M型商业模型的电子模块。

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

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