IEC 61189-5-601:2021 电气材料、印制板和其他互连结构和组件的试验方法第5-601部分:材料和组件的一般试验方法焊点的回流焊接能力试验和印制板的回流耐热试验

标准编号：IEC 61189-5-601:2021

中文名称：电气材料、印制板和其他互连结构和组件的试验方法第5-601部分:材料和组件的一般试验方法焊点的回流焊接能力试验和印制板的回流耐热试验

英文名称：Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for

发布日期：2021-02-03

标准范围

IEC 61189-5-601:2021规定了安装在有机刚性印刷电路板上的组件的回流焊接能力测试方法、有机刚性印刷电路板的回流耐热性测试方法以及在使用焊料合金（共晶或近共晶锡铅（Pb）或无铅合金）的应用中有机刚性印刷电路板的焊盘的回流焊接能力测试方法。这种有机刚性印刷电路板的印刷电路板材料是IEC 61249-2（所有部件）中规定的环氧编织E-玻璃层压板。本文件的目的是确保焊点和印刷电路板焊盘的焊接能力。此外，还提供了测试方法以确保印刷电路板能够抵抗它们在焊接期间所暴露的热负荷。

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

标准预览图