IEC 60115-4:2022 电子设备用固定电阻器.第4部分:分规范:电路板通孔组件（THT）或底盘组件用功率电阻器

标准编号：IEC 60115-4:2022

中文名称：电子设备用固定电阻器.第4部分:分规范:电路板通孔组件（THT）或底盘组件用功率电阻器

英文名称：Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

发布日期：2022-11-29

标准范围

IEC 60115-4:20 22(E)涉及用于电子设备的额定耗散通常大于1W至1000W且包括1000W的电阻器。本文件适用于最高表面温度（MET）高于200°C的优选上限温度（UCT）的固定功率电阻器。笔记？散热器电阻器，即由于其特殊的温度条件而在其操作中依赖于安装在专用散热器上的电阻器，由特殊的截面规范涵盖（在公布时正在考虑）。这些电阻器通常根据类型（不同的几何形状）和样式（不同的尺寸）以及产品技术来描述。本文件的目的是定义优选的额定值和特性，并从IEC 60115-1适当的质量评估程序、试验和测量方法，并给出该类型电阻器的一般性能要求。笔记？SMD电阻器受IEC 60115-8保护，无论其耗散如何。与上一版相比，此版本包括以下重大技术变更:已采用通用规范IEC 60115-1:20 20中产品技术和产品分类级别的定义；4.2中修改了轴向引线电阻器引线偏心度可选规范的依据；IEC 60115-1:20 20，8.3的“周期脉冲高压过载试验”已被采用为5.3.9中的默认试验方法，从而取代了IEC 60115-1:20 20，8.4的传统试验“周期脉冲过载试验”；5.3.22和5.3.23采用了IEC 60115-1:20 20,11.1修订后的可焊性试验；5.3.25已采用IEC 60115-1:20 20，11.3的组合耐溶剂试验；IEC 60115-1:20 20，7.2的“室温耐久性试验”已重新制定并在5.3.5中采用；IEC 60115-1:20 20，8.2的“单脉冲高压过载试验”，在5.3.8中应用脉冲形状10/700，由5.4.1中脉冲形状1，2/50提供的可选替代方案补充。IEC 60115 1:20 20，10.2的“低温运行”和IEC 60115的“湿热、稳态、加速”的气候试验？1:20 20，10.5，已作为5.4.5中的可选测试采用。和5.4.6；作为5.4.8纳入可选的可燃性试验；6中提供了新的指南。2关于稳定性要求及其允许的绝对和相对偏差的表述；在6.5和附录B中增加了目视检查的验收标准；6.5.3和7.2中增加了内包装和邻近包装的目视检查；9.8中增加了终端镀层的定期评估作为质量评估的新课题；已应用IEC 60115-1:20 20的修订测试条款编号；增加了新的附录C，以总结引线功率电阻器组装的工艺要求，例如在先前的IEC 61192系列标准中给出的要求；关于径向成形样式的信息性附录F已进行修订，详细介绍了用于表面贴装装配的成形Z形弯曲样式；此外，资料性附件十已

IEC 60115-4:2022(E) relates to resistors having a rated dissipation typically greater than 1 W up to and including 1 000 W for use in electronic equipment. This document is applicable to fixed power resistors with a maximum surface temperature (MET) higher than the preferred upper category temperature (UCT) of 200 °C.
NOTE？Heat sink resistors, i.e. resistors which in their operation depend on being mounted on a dedicated heat sink, owing to their special temperature conditions, are covered by a special sectional specification (under consideration at the time of publication).
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions), and product technology.
The object of this document is to define preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
NOTE？SMD resistors are covered by IEC 60115-8, regardless of their dissipation.
This edition includes the following significant technical changes with respect to the previous edition:

1. the definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
2. a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
3. the 'period-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been adopted as default test method in 5.3.9, thereby replacing the legacy test 'periodic-pulse overload test of IEC 60115-1:2020, 8.4;
4. the revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and 5.3.23;
5. the combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.25;
6. the 'endurance at room temperature test' of IEC 60115-1:2020, 7.2 has been reworked and adopted in 5.3.5;
7. the 'single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.1.
8. climatic tests for 'operation at low temperature' of IEC 60115 1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115？1:2020, 10.5, have been adopted as optional tests in 5.4.5. and 5.4.6, respectively;
9. inclusion of an optional flammability test as 5.4.8;
10. new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
11. acceptance criteria for the visual inspection have been added in 6.5 and in Annex B;
12. visual inspection for the primary and proximity packaging has been added in 6.5.3 and in 7.2;
13. the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
14. the revised test clause numbering of IEC 60115-1:2020 has been applied;
15. a new Annex C has been added to summarize workmanship requirements for the assembly of leaded power resistors, e.g. as given in the prior IEC 61192 series of standards;
16. the informative Annex F on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly;
17. furthermore, the informative Annex X has been ad

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