IEC 61760-1:2020 表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

标准编号：IEC 61760-1:2020

中文名称：表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

英文名称：Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

发布日期：2020-07-14

标准范围

IEC 61760-1:20 20定义了用于表面贴装技术的电子元件的元件规格要求。为此，它规定了一套参考的工艺条件和相关测试条件，以便在编制组件规格时加以考虑。本文件的目的是确保各种SMD在组装过程中可以经历相同的放置、安装和后续过程（例如清洁、检查）。本文件定义了需要作为任何SMD元件的一般、分段或详细规范的一部分的测试和要求。此外，本文档还为组件用户和制造商提供了一套用于表面贴装技术的典型工艺条件的参考。本文档中元件规格的一些要求也适用于带有用于安装在电路板上的引线的元件。适当的情况在相关子条款中指出。与上一版相比，此版本包括以下重大技术变更:a)包括附加的安装方法:导电胶接、烧结和无焊互连。

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

标准预览图