IEC 62047-43:2024 半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

标准编号：IEC 62047-43:2024

中文名称：半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

英文名称：Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices

发布日期：2024-03-19

标准范围

IEC 62047-43:2024规定了柔性机电设备循环弯曲变形后电气特性的试验方法。这些器件包括柔性膜上或嵌入柔性膜中的无源微元件和有源微元件。试验方法所需的装置平面内尺寸通常为1 mm至300 mm，厚度为10μm至1 mm，但这些不是限制值。试验方法的设计是为了理解和进一步可视化循环弯曲变形后的整个性能退化行为，采用3D（P-S-N:性能-弯曲严重程度-循环次数）在弯曲严重程度和重复循环次数的加载空间上的曲线图。本文件对于在一定程度的循环弯曲变形下估计运行期的安全裕度至关重要，对于使用这些设备的产品的可靠设计也是必不可少的。

IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 μm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.

标准预览图