IEC 62047-35:2019 半导体器件.微机电装置.第35部分:挠性机电装置弯曲变形电特性的试验方法

标准编号：IEC 62047-35:2019

中文名称：半导体器件.微机电装置.第35部分:挠性机电装置弯曲变形电特性的试验方法

英文名称：Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

发布日期：2019-11-22

标准范围

IEC 62047-35:2019规定了柔性机电设备弯曲变形下电气特性的试验方法。这些器件包括柔性膜上或嵌入柔性膜中的无源微组件和/或有源微组件。试验方法所需的装置平面内尺寸通常为1 mm至300 mm，厚度范围为10 mm至1 mm，但这些不是限制值。试验方法的设计应确保以准静态方式单调弯曲装置，直至达到最大可能曲率，即。e、 直到装置完全折叠，从而获得弯曲变形下电性能的整体退化行为。本文件对于估算特定弯曲变形下的安全裕度至关重要，对于采用这些装置的产品的可靠设计必不可少。

IEC 62047-35:2019 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 mm to 1 mm, but these are not limiting values. The test method is so designed as to bend devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded, so that the entire degradation behaviour of the electric property under bending deformation is obtained. This document is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.

标准预览图