IEC 61249-2-51:2023 印制板和其他互连结构材料.第2-51部分:包覆和非包覆增强基材.非包覆集成电路卡载带基材

标准编号：IEC 61249-2-51:2023

中文名称：印制板和其他互连结构材料.第2-51部分:包覆和非包覆增强基材.非包覆集成电路卡载带基材

英文名称：Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

发布日期：2023-05-11

标准范围

IEC 61249-2-51:2023规定了集成电路卡载带基材、未包层（以下简称IC载带基材）的构造、材料、性能要求、质量保证、包装、标记、贮存。本文件适用于IC载带基材，为涂胶材料，一面为编织E-玻璃增强环氧底层，另一面涂有粘合剂并由离型膜保护。

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

标准预览图