IEC TR 62878-2-7:2019 器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

标准编号：IEC TR 62878-2-7:2019

中文名称：器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

英文名称：Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

发布日期：2019-03-20

标准范围

IEC TR 62878-2-7:2019（E）描述了无源嵌入式电路板的加速应力测试。它可用于筛选成品板，包括多层和高密度互连（HDI）板。这些板主要用于移动设备。

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

标准预览图