IEC 60749-20:2020 半导体器件 - 机械和气候测试方法 - 第20部分:塑料封装Smds的电阻与水分和焊接热的组合效应

标准编号：IEC 60749-20:2020

中文名称：半导体器件 - 机械和气候测试方法 - 第20部分:塑料封装Smds的电阻与水分和焊接热的组合效应

英文名称：Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

发布日期：2020-08-31

标准范围

IEC 60749-20:20 20作为IEC 60749-20:20 20 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-20:20 20提供了一种评估封装为塑料封装表面贴装器件(SMD)的半导体的耐焊接热性的方法。这个测试是破坏性的。与上一版相比，此版本包括以下重大技术变更:-纳入IEC 60749-20:20 08(第二版)的技术勘误；-加入新订的第3条；-列入解释性说明。

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

标准预览图