ISO/IEC TS 22924:2021 识别卡 传输层拓扑 HCI/HCP交换的配置

标准编号：ISO/IEC TS 22924:2021

中文名称：识别卡 传输层拓扑 HCI/HCP交换的配置

英文名称：Identification cards — Transport layer topologies — Configuration for HCI/HCP interchange

发布日期：2021-05

标准范围

本文档规定了对源自HCI/HCP（参见ETSI TS 102 622）的协议的要求，该协议支持设备的通信，而不考虑数据链路和物理层。本文件涵盖以下内容:a)包括一个或多个主机和一个控制器的系统的概要；b)主机和主机控制器之间的连接拓扑的扩展(即星形拓扑和附加的其他拓扑)；c)使用ETSI TS102 613的现有系统和符合本文件的新系统之间的隔离（本文件参考ETSI TS102 613，但不改变其规范，也不使用RFU）。对于ETSI TS 102 622，数据链路层和物理层（如ETSI TS 102 613中指定的SWP）在范围之外。尽管在本文档中提出了质疑，但通过例如强制将HCP封装为T=1或相反来复制OSI传输层超出了范围。

This document specifies the requirements for a protocol derived from HCI/HCP (see ETSI TS 102 622) enabling communication for devices regardless of data link and physical layers. This document covers the following:
a) outline of a system comprised of one or more hosts and one controller;
b) extension of connection topology between hosts and host controller (i.e. star topology and additional other topologies);
c) segregation between existing system using ETSI TS102 613 and new system compliant to this document (this document refers ETSI TS 102 613, but does not change its specification and does not use RFU).
For ETSI TS 102 622, data link layer and physical layer like SWP specified in ETSI TS 102 613 is out of the scope.
Albeit questioned in this document, the duplication of OSI transport layer by e.g. enforcing encapsulation of HCP into T=1 or the reverse, is out of the scope.

标准预览图