ISO 9455-17:2002 软焊量-试验方法-第17部分：流量残余物电气化学移动和梳状试验表面绝缘阻力

标准编号：ISO 9455-17:2002

中文名称：软焊量-试验方法-第17部分：流量残余物电气化学移动和梳状试验表面绝缘阻力

英文名称：Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

发布日期：2002-12

标准范围

ISO 9455-17:2002规定了焊接或镀锡试样后焊剂残留物可能产生的有害影响的测试方法。本试验适用于固体或液体形式的1型和2型焊剂，或由共晶或近共晶锡/铅焊料构成的药芯焊丝、焊料预制件或焊膏形式的1型和2型焊剂。本试验方法也适用于无铅焊料用助焊剂。但是，经测试人员和客户同意，可以调整焊接温度。

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

标准预览图