ISO 4386-1:2019 滑动轴承 金属多层滑动轴承 第1部分：厚度不小于0.5毫米结合处的无损超声检测

标准编号：ISO 4386-1:2019

中文名称：滑动轴承 金属多层滑动轴承 第1部分：厚度不小于0.5毫米结合处的无损超声检测

英文名称：Plain bearings — Metallic multilayer plain bearings — Part 1: Non-destructive ultrasonic testing of bond of thickness greater than or equal to 0,5 mm

发布日期：2019-04

标准范围

本文件规定了一种超声波检测方法，用于确定轴承金属和背衬之间的粘结缺陷。该试验可在金属多层滑动轴承上进行，该轴承由钢或铜基材料衬垫组成，内衬以铅和锡为基础的轴承金属，层厚大于或等于0.5mm。本文件适用于铸铁背衬，但有限制。轴承金属和背衬之间的粘结界面反射的超声波信号用于确定粘结缺陷。由于未定义的反射，在小于超声波探头直径一半的范围内，无法对滑动面边缘区域、法兰侧、接头区域、油孔、凹槽等进行超声波检测。这同样适用于接合处带有燕尾键槽的轴承。粘接超声波检测不适用于燕尾榫边缘。只有通过ISO 4386-3中规定的渗透检测方法，才能对从衬垫到轴承金属（端面或接合面）的可见过渡层上的粘结进行评估。本文件仅详细描述脉冲回波法。在本文件的含义范围内，超声波方法仅允许对粘结进行定性评估，而不允许对粘结强度进行定量测定。超声波粘结测试仅在粘结和粘结缺陷之间有所不同。

This document specifies an ultrasonic testing method for determining bond defects between the bearing metal and the backing. The test can be performed on metallic multilayer plain bearings consisting of steel- or copper-based material backings lined with bearing metal based on lead and tin, with layer thicknesses greater than or equal to 0,5 mm. For cast iron backings, this document is applicable with restrictions.The ultrasonic signal reflected by the bond interface between the bearing metal and the backing is used to determine bonding defects.Ultrasonic testing is not possible on edge zones of sliding surface, flange sides, joint areas, oil holes, grooves, etc. in a range of less than half the diameter of the ultrasonic probe because of undefined reflections. The same applies to bearings with dovetail keying grooves at the bond. Ultrasonic testing of bond does not apply along the edges of the dovetails.Evaluation of the bond on the visible transition from the backing to the bearing metal (on end faces or joint faces) is only practicable by the penetrant testing method specified in ISO 4386-3.This document only describes in detail the pulse-echo method. Within the meaning of this document, the ultrasonic method only permits a qualitative evaluation of the bonding and not a quantitative determination of the bond strength. The ultrasonic bond test differs only between bond and bond defect.

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