ISO 9455-17:2024 软钎焊剂 试验方法 第17部分：钎剂残留物的表面绝缘电阻梳刷试验和电化学迁移试验

标准编号：ISO 9455-17:2024

中文名称：软钎焊剂 试验方法 第17部分：钎剂残留物的表面绝缘电阻梳刷试验和电化学迁移试验

英文名称：Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

发布日期：2024-01

标准范围

本文件规定了焊接或镀锡试片后焊剂残留物可能产生的有害影响的测试方法。该测试适用于类型？1和类型？2通量，如ISO规定？9454-1，固体或液体形式，或由共晶或近共晶锡/铅（Sn/Pb）或Sn95，5Ag3Cu0，5或用户和供应商商定的其他无铅焊料构成的药芯焊丝、焊料预制件或焊膏（见ISO？9453）。本试验方法也适用于用于含铅和无铅焊料的助焊剂。然而，焊接温度可以在测试人员和客户之间协商一致的情况下进行调整。

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).

This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

标准预览图